Introduction

The ThinkSystem SE350 is a purpose-built server that is half the width and significantly shorter than a traditional server, making it ideal for deployment in tight spaces. It can be mounted on a wall, stacked on a shelf or mounted in a rack. The ThinkSystem SE350 puts increased processing power, storage and network closer to where data is generated, allowing actions resulting from the analysis of that data to take place more quickly.

This product guide provides essential pre-sales information to understand the ThinkSystem SE350 edge server, its key features and specifications, components and options, and configuration guidelines. This guide is intended for technical specialists, sales specialists, sales engineers, IT architects, and other IT professionals who want to learn more about the SE350 and consider its use in IT solutions.

Introduction
The ThinkSystem SE350 is a purpose-built server that is half the width and significantly shorter than a traditional server, making it ideal for deployment in tight spaces. It can be mounted on a wall, stacked on a shelf or mounted in a rack. The ThinkSystem SE350 puts increased processing power, storage and network closer to where data is generated, allowing actions resulting from the analysis of that data to take place more quickly.

Suggested uses: edge computing (IoT, AI, machine learning), retail, video security, inventory management, building control, telecommunications, manufacturing, distribution

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Customers looking for computing solutions at the edge of their networks often have to compromise -- to use either datacenter-class equipment which is too large and power hungry, or PC based equipment which can't run their enterprise level applications. The ThinkSystem SE350 fits the space between those two extremes. Its compact design, low power usage, and high performance are just the right combination for edge locations. The SE350 can be wall mounted, stacked on a shelf or installed in a rack. It is also designed to operate in rugged environments, up to 55°C.

Processor

Processor manufacturer

Intel

Processor model

D-2123IT

Processor frequency

2.2 GHz

Processor boost frequency

3 GHz

Processor family

Intel® Xeon® D

Processor cores

4

Processor cache

8 MB

Number of processors installed

1

Thermal Design Power (TDP)

60 W

Processor socket

FCBGA2518

Processor lithography

14 nm

Processor threads

8

Processor operating modes

64-bit

Stepping

M1

Bus type

UPI

Processor codename

Skylake

Maximum internal memory supported by processor

512 GB

Memory types supported by processor

DDR4-SDRAM

Memory clock speeds supported by processor

2400 MHz

Execute Disable Bit

Y

Idle States

Y

Thermal Monitoring Technologies

Y

Maximum number of PCI Express lanes

32

Supported instruction sets

AVX 2.0

Processor code

SR3ZW

Scalability

1S

Embedded options available

Y

Conflict-Free processor

Y

Memory

Internal memory

16 GB

Internal memory type

DDR4-SDRAM

Memory slots

4

ECC

Y

Memory clock speed

2666 MHz

Memory layout (slots x size)

1 x 16 GB

Maximum internal memory

256 GB

Storage

Total storage capacity

480 GB

Number of SSDs installed

1

SSD capacity

480 GB

SSD interface

SATA

SSD size

M.2

RAID support

Y

RAID levels

0,1,5,10

Optical drive type

N

Graphics

On-board graphics card

Y

On-board graphics card model

Matrox G200

Network

Ethernet LAN

Y

Cabling technology

10/100/1000Base-T(X)

Ethernet interface type

10 Gigabit Ethernet, Gigabit Ethernet

Ports & interfaces

USB 2.0 ports quantity

2

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity

2

VGA (D-Sub) ports quantity

1

Design

Chassis type

Rack (1U)

Product colour

Black

Performance

BIOS type

UEFI

Trusted Platform Module (TPM)

Y

Trusted Platform Module (TPM) version

2.0

Software

Compatible operating systems

Microsoft Windows Server, Red Hat Enterprise Linux, SUSE Linux Enterprise Server, VMware ESXi

Processor special features

CPU configuration (max)

1

Enhanced Intel SpeedStep Technology

Y

Intel Virtualization Technology for Directed I/O (VT-d)

Y

Intel® Hyper Threading Technology (Intel® HT Technology)

Y

Intel® Turbo Boost Technology

2.0

Intel® AES New Instructions (Intel® AES-NI)

Y

Intel Trusted Execution Technology

Y

Intel Enhanced Halt State

Y

Intel VT-x with Extended Page Tables (EPT)

Y

Intel® Secure Key

Y

Intel TSX-NI

Y

Intel® OS Guard

Y

Intel Software Guard Extensions (Intel SGX)

N

Intel 64

Y

Intel Secure Key Technology version

1.00

Intel Virtualization Technology (VT-x)

Y

Intel TSX-NI version

1.00

Intel QuickAssist Technology

N

Processor ARK ID

136429

Power

Redundant power supply (RPS) support

Y

Number of redundant power supplies installed

2

Operational conditions

Operating temperature (T-T)

5 - 45 °C

Storage temperature (T-T)

-40 - 60 °C

Operating relative humidity (H-H)

8 - 90%

Storage relative humidity (H-H)

5 - 95%

Weight & dimensions

Width

209 mm

Depth

376 mm

Height

43 mm

Weight

3.75 kg