Introduzione

2nd Generation Intel® Xeon® Scalable Family Ready
GIGABYTE’s servers are fully ready to support the second generation of Intel® Xeon® Scalable Family processors, codenamed “Cascade Lake”, which bring the following major enhancements:

Intel® Optane™ Persistent Memory: Built-in support for this revolutionary new product based on Intel’s 3D Xpoint technology
Overall Performance: Higher CPU frequencies, improved turbo profiles vs. prior-gen Intel Xeon Scalable processors
Increased DDR4 Memory Speed & Capacity: Up to 2933MHz (1 DIMM per channel on some SKUs), 16Gb based DIMM supported
Intel Deep Learning Boost: Significantly accelerates inference performance for deep learning workloads optimized to use VNNI (Vector Neural Network Instructions)
Security: Hardware mitigations for Meltdown / Spectre security vulnerabilities

Intel® Xeon® Scalable Family Processors
GIGABYTE’s Intel® Xeon® Scalable Processor family servers are available in dual socket configurations, and are compatible with the full family* of different SKUs (Bronze, Silver, Gold and Platinum) that are workload optimized to support different applications, from enterprise IT database, cloud and storage to the most high-demand HPC workloads.

Intel® Optane™ Persistent Memory Ready
GIGABYTE’s second generation Intel® Xeon® Scalable family servers come ready to support Intel® Optane™ Persistent Memory, a revolutionary new product that re-defines traditional memory & storage architectures by enabling a large persistent memory tier between DRAM and SSDs, that’s higher capacity than DRAM and faster than SSDs, enabling the user to bring more data closer to the CPU for faster time for insight.

Optane Persistent Memory Modules (“PMem”) integrate seamlessly into existing DDR4 DIMM slots, and use Intel’s 3D Xpoint memory technology, which unlike DRAM retains data after power is removed. The modules will be available in capacities up to 512GB – a massive increase compared to the current maximum 128GB of industry-leading DDR4 memory sticks – and can be addressed by the OS or application either as memory (Memory Mode) or storage (Application Direct Mode).

Processor

Processor socket

LGA 3647 (Socket P)

Processor manufacturer

Intel

Processor family

Intel® Xeon®

Number of processors supported

2

Memory

Number of DIMM slots

32

Supported memory types

DDR4-SDRAM

Supported RDIMM clock speeds

2933,3200 MHz

Supported UDIMM clock speeds

3200 MHz

Storage

Number of storage drives supported

12

Hot-swap HDD bays

Yes

Number of 3.5" bays

12

Storage drive sizes supported

3.5"

Supported storage drive interfaces

Serial ATA III, Serial Attached SCSI (SAS)

Ports & interfaces

USB 3.2 Gen 1 (3.1 Gen 1) Type-A ports quantity

2

Ethernet LAN (RJ-45) ports

3

VGA (D-Sub) ports quantity

1

Expansion slots

PCI Express x16 slots

13

Features

Compatible operating systems

Windows Server 2016 (X2APIC/256T not supported) Windows Server 2019 Red Hat Enterprise Linux 7.6 ( x64) or later Red Hat Enterprise Linux 8.0 ( x64) or later Red Hat Enterprise Linux 9.0 (x64) or later SUSE Linux Enterprise Server 12 SP4 ( x64) or later SUSE Linux Enterprise Server 15 SP1 ( x64) or later Ubuntu 16.04.6 LTS (x64) or later Ubuntu 18.04.3 LTS (x64) or later Ubuntu 20.04 LTS (x64) or later VMware ESXi 6.5 EP15 or later VMware ESXi 6.7 Update3 or later VMware ESXi 7.0 or later VMware ESXi 8.0 or later Citrix Hypervisor 8.1.0 or later

Design

Number of fans

16 fan(s)

Power

Power supply

2200 W

Number of main power supplies

3

Redundant power supply (RPS) support

Yes

Number of redundant power supplies supported

3

Number of redundant power supplies installed

3

AC input voltage

200 - 240 V

DC output current (+12 V)

178 A

Operational conditions

Operating temperature (T-T)

10 - 35 °C

Storage temperature (T-T)

-40 - 60 °C

Operating relative humidity (H-H)

10 - 35%

Storage relative humidity (H-H)

20 - 95%

Weight & dimensions

Width

448 mm

Depth

880 mm

Height

176 mm

Packaging data

Package width

1109 mm

Package depth

609 mm

Package height

606 mm